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Achievement of thermal uniformity in wafers subjected to rapid temperature increase is a challenge for both the hardware design and process control. The two are coupled and must be designed and optimized simultaneously.
In this project, we developed a whole-system model of an RTP furnace, capturing radiative heating by rows of light sources as well as multiple reflective surfaces in the chamber. The developed model was then complemented with a model of the process control algorithm. The complete system was used to analyze a number of lamp arrangements, furnace geometry, and control algorithms to identify the optimal hardware/software combination.
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